View BD4153FV09_4941416.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Power Management Switch IC Series for PCs and Digital Consumer Product
Power Switch ICs for ExpressCardTM
BD4153FV,BD4153EFV
No.09029EAT08
Description TM BD4153FV/EFV is a power management switch IC for the next generation PC card (ExpressCard ) that PCMCIA recommends. TM TM TM Conforms to PCMCIA's ExpressCard Standard, ExpressCard Compliance Checklist, and ExpressCard Implementation Guideline, and obtains the world first Compliance ID "EC100001" from PCMCIA. Offers various functions such as adjustable soft-starter, overcurrent detector (OC function), card detector, and system condition detector, which are ideally suited for laptop and desktop computers. Features TM 1) Incorporates three low on-resistance FETs for ExpressCard . 2) Incorporates an FET for output discharge. 3) Incorporates an enabler. 4) I Incorporates an undervoltage lockout (UVLO) 5) I Employs SSOP-B24 package. 6) I Employs HTSSOP-B24 package. 7) Incorporates a thermal shutdown protector (TSD). 8) Incorporates a soft-starter. 9) Incorporates an overcurrent protector (OCP). 10) Incorporates an overcurrent flag output (OC). 11) Conforms to ExpressCardTM Standard. TM 12) Conforms to ExpressCard Compliance Checklist. 13) Conforms to ExpressCardTM Implementation Guideline. Use Laptop and desktop computers, and other digital devices equipped with ExpressCard. Lineup Parameter Package BD4153FV SSOP-B24 BD4153EFV HTSSOP-B24
"ExpressCardTM" is a trademark registered by PCMCIA(Personal Computer Memory Card International Association).
Absolute Maximum Ratings BD4153FV/BD4153EFV Parameter Power Supply Voltage Logic Input Voltage Logic Output Voltage 1 Logic Output Voltage 2 Input Voltage 1 Input Voltage 2 Output Voltage Output current 1 Output current 2 Power Dissipation 1 Power Dissipation 2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature
Symbol VCC EN,CPPE#,CPUSB#,SYSR,PERST_IN# OC PERST# V3_IN, V15_IN V3AUX_IN V3,V3AUX,V15 IOV3, IOV15 IOV3AUX Pd1 Pd2 Topr Tstg Tjmax
BD4153FV 5.0 *1 5.0 *1 5.0 *1 VCC *1 5.0 *1 VCC *1 5.0 *1 2.0 1.0 787 *2 1025 *3 -40+100 -55+150 +150
BD4153EFV 5.0 *1 5.0 *1 5.0 *1 VCC *1 5.0 *1 VCC *1 5.0 *1 2.0 1.0 1100 *4 -40+100 -55+150 +150
Unit V V V V V V V A A mW mW
*1 However, not exceeding Pd. *2 Pd derating at 6.3mW/ for temperature above Ta=25 *3 In the case of Ta25C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.2 mW/C. *4 In the case of Ta25C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.8 mW/C.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
1/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Recommended Operating Conditions BD4153FV/BD4153EFV Parameter Power Supply Voltage Logic Input Voltage 1 Logic Input Voltage 2 Logic Output Voltage 1 Logic Output Voltage 2 Input Voltage 1 Input Voltage 2 Input Voltage 3 Soft Start Setup Capacitor 1 Soft Start Setup Capacitor 2
Technical Note
Symbol
MIN 3.0 -0.2 -0.2 3.0 3.0 1.35 0.001 0.001
MAX 3.6 3.6 VCC 3.6 VCC 3.6 VCC 1.65 1.0 0.1
Unit V V V V V V V V F F
VCC EN CPPE#,CPUSB#,SYSR,PERST_IN# OC PERST# V3_IN V3AUX_IN V15_IN CSS_V3, CSS_V15 CSS_V3AUX
* This product is designed for protection against radioactive rays.
Electrical Characteristics (unless otherwise noted, Ta=25 VCC=3.3V VEN=3.3V V3_IN=V3AUX_IN=3.3V,V15_IN=1.5V) Standard Value Parameter Symbol Unit MIN TYP MAX Standby current Bias current 1 Bias current 2 [Enable] High Level Enable Input Voltage Low Level Enable Input Voltage Enable Pin Input current [Logic (CPPE#,CPUSB#)] High Level Logic Input Voltage Low Level Logic Input Voltage Logic Pin Input current [Logic (SYSR)] High Level Logic Input Voltage Low Level Logic Input Voltage Logic Pin Input current [Logic (PERST_IN#)] High Level Logic Input Voltage Low Level Logic Input Voltage Logic Pin Input current VPSTHI VPSTLOW IPST 2.3 -0.2 -18 -11 VCC 0.8 -6 V V A VSYSRHI VSYSRLOW ISYSR 2.3 -0.2 6 11 VCC 0.8 18 V V A VLHI VLLOW IL 2.3 -0.2 -1 0 VCC 0.8 1 V V A VENHI VENLOW IEN 2.3 -0.2 3 5.5 0.8 10 V V A VEN=3V IST Icc1 Icc2 35 0.25 1.0 70 0.50 2.0 A mA mA VEN=0V
Condition
VSYSR=0V VSYSR=3.3V
VCPPE#=3.3V or VCPUSB#=3.3V
VSYSR=3.3V
VPERST_IN#=0V
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
2/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Electrical Characteristics - Continued (unless otherwise noted, Ta=25 VCC=3.3V VEN=3.3V V3_IN=V3AUX_IN=3.3V,V15_IN=1.5V) Standard Value Parameter Symbol Unit MIN TYP MAX [Switch V3] On Resistance Discharge On Resistance [Switch V3AUX] On Resistance Discharge On Resistance [Switch V15] On Resistance Discharge On Resistance [Soft Start] Charge current SS_V3 High Voltage SS_V15 High Voltage SS_V3AUX High Voltage Discharge current Low Voltage [Over Current Protection] OC Flag V3 V3 Over current OC Flag V3AUX V3AUX Over current OC Flag V15 V15 Over current OC_Delay Charge current OC_Delay Discharge current OC_Delay Standby Voltage OC_Delay Threshold Voltage OC Low Voltage OC Leak current [Under Voltage Lockout] V3_IN UVLO OFF Voltage V3_IN Hysteresis Voltage V3AUX_IN UVLO OFF Voltage V3AUX_IN Hysteresis Voltage V15 UVLO OFF Voltage V15 Hysteresis Voltage VCC UVLO OFF Voltage VCC Hysteresis Voltage
* Design Guarantee
Technical Note
Condition
RV3 RV3Dis RV3AUX RV3AUXDis RV15 RV15Dis Ichr SS_V3high SS_V15high SS_AUXhigh IDis SSLOW OCPV3_S OCPV3 OCPV3AUX_S OCPV3AUX OCPV15_S OCPV15 IOCP_Delaych IOCP_Delaydis VOCP_Delayst VOCP_Delayth VOCP IOCP VUVLOV3_IN VUVLOV3_IN VUVLOV3AUX_IN VUVLOV3AUX_IN VUVLOV15 VUVLO15 VUVLOVCC VUVLOVCC
1.0 V3+4 V15+4 1.5 0.3 1.0 2.0 0.25 0.50 0.50 1.20 1.0 1.0 0.6 2.80 80 2.80 80 1.25 50 2.80 80
35 60 100 60 42 60 2.0 V3+5 V15+5 1.8 1.0 2.0 2.0 0.7 0.1 2.90 160 2.90 160 1.30 100 2.90 160
73 150 210 150 85 150 3.0 V3+6 V15+6 2.1 50 3.0 50 0.8 0.2 1 3.00 240 3.00 240 1.35 150 3.00 240
m m m A V V V mA mV A A A A A A A mA mV V V A V mV V mV V mV V mV
Tj=-10100 *
Tj=-10100 *
Tj=-10100 *
Vss=1V
VOC_DELAY=1V
IOC=0.5mA VOC=3.65V sweep up sweep down sweep up sweep down sweep up sweep down sweep up sweep down
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
3/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Reference data
Technical Note
V3AUX V3AUX V3 V3 V3 CP# CP# SYSR CP# SYSR SYSR V3AUX
Fig.1 System Stand-byActive (Card)
Fig.2 System ActiveStand-by (Card)
Fig. System Stand-byActive (No Card)
V3AUX
V3AUX
CPUSB#
V3 CP#
V3 CP#
V3
V3AUX
SYSR
SYSR
PERST#
Fig.4 PCI Card Assert/DeAssert (Stand-by)
V3 RISETIME
10000
Fig.5 Card Assert/DeAssert (Active)
V3 rise propagation delay TIME
10000
Fig.6 USB Card Assert/ DeAssert (Active)
PERST#
Delay Time (ms)
1000
1000
Rise Time (ms)
100
100
V3
10
10
1
1
SS_V3 Logic Input(SYSR)
1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06
0.1 1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06
0.1
0.01
CSS_V3 (F)
0.01
CSS_V3 (F)
Fig.7 V3 RISETIME
Fig.8 V3 rise Propagation delay TIME
Fig.9 V3 Start up (Stand-byActive)
V3AUX RISE TIME
PERST#
PERST#
10000
Delay Time (ms) Logic Input(EN)
V3
V3
SS_V3 Logic Input(CP#)
SS_V3
(
1 0.1
)
1000
100
10
1.00E-10 0.01
1.00E-09
1.00E-08
1.00E-07
CSS_V3AUX (F)
Fig.10 V3 Start up (Card Assert)
Fig.11 V3 Wave Form (Shut downActive)
Fig.12 V3AUX RISE TIME
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
4/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Technical Note
V3AUX rise propagation delay
10000
PERST#
PERST#
1000
Delay Time (ms)
100
V3AUX
V3AUX
10
SS_V3AUX
1
SS_V3AUX Logic Input(SYSR) Logic Input(CP#)
0.1 1.00E-10 0.01 1.00E-09 1.00E-08 1.00E-07
CSS_V3AUX (F)
Fig.13 V3AUX rise propagation delay
Fig.14 V3AUX Start up (Stand-byActive)
V15 RISE TIME
10000 10000
Fig.15 V3AUX Start up (Card Assert)
V15 rise propagation delay time
PERST#
1000
1000
V3AUX
Delay Time (ms)
Delay Time (ms)
100
100
10
10 1 1
SS_V3AUX Logic Input(EN)
1
0.1 1.00E-10 0.01 1.00E-09 1.00E-08 1.00E-07
0.1 1.00E-10 0.01 1.00E-09 1.00E-08 1.00E-07
CSS_V15 (F)
CSS_V15 (F)
Fig.16 V3AUX Start up (Shut downActive)
Fig.17 V15 RISE TIME
Fig.18 V15 rise propagation delay time
PERST#
PERST#
PERST#
V15
V15
V15
SS_V15 Logic Input(SYSR)
SS_V15 Logic Input(CP#)
SS_V15 Logic Input(EN)
Fig.19 V15 Start up (Stand-byActive)
Fig.20 V15 Start up (Card Assert)
Fig.21 V15 Start up (Shut downActive)
Ishort(500mA/div)
OCP_DELAY
PERST#
PERST#
OCP_FLAG SYSR
PERST#_DELAY
PERST#_DELAY SYSR
V3AUX
Fig.22 V3AUX Short Circuit
Fig.23 PERST# LH Wave Form
Fig.24 PERST# HL Wave Form
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
5/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Block Diagram
Technical Note
V3_IN1
V3-1 21 22 VD 3 4 V3-2 2 20 TSD,CL,UVLO
3.3V/1.30A
3.3V
V3_IN2 SS_V3 V3AUX_IN
3.3V AUX/275mA V3AUX_IN 5 V3AUX
3.3V SS_V3AUX 6 V15_IN1 V15_IN2 1.5V 17 18 VD CPPE# 11 CPUSB# SYSR SS_V15 12 10 16 Input logic TSD,CL,UVLO EN,SYSR,CPUSB#,CPPE# Thermal protection Power good 19 VCC 7 13 VCC 24 EN 23 TSD V3_IN,V3AUX_IN,V15 V3,V3AUX,V15 Reference Block V3_IN V3AUX_IN Charge Pump VD V15_IN VCC 15 Under voltage lock out UVLO_AUX 1 GND 14 OC_DELAY UVLO OC PERST#_DELAY CL PERST# PERST_IN#
TSD,CL,UVLO_AUX V15-1 1.5V/625mA
8 9
V15-2
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
6/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Pin Configration
Technical Note
GND 1 SS_V3 2 V3_1 3 V3_2 4 V3AUX 5 SS_V3AUX 6 PERST_IN# 7 (SysReset#) V15_1 8 V15_2 9 SYSR 10 CPPE# CPUSB# 11 12
24 VCC 23 EN 22 V3_IN2 21 V3_IN1 20 V3AUX_IN 19 PERST# 18 V15_IN2 17 V15_IN1 16 SS_V15 15 OC 14 OC_DELAY 13 PERST#_DELAY
SSOP-B24 Package
Pin Function PIN No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 PIN NAME GND SS_V3 V3_1 V3_2 V3AUX SS_V3AUX PERST_IN# V15_1 V15_2 SYSR CPPE# CPUSB# PERST#_DELAY OC_DELAY OC SS_V15 V15_IN1 V15_IN2 PERST# V3AUX_IN V3_IN1 V3_IN2 EN VCC PIN FUNCTION GND pin V3 soft start pin V3 output pin 1 V3 output pin 2 V3AUX output pin V3AUX soft start pin PERST# control input pin (SysReset#) V15 output pin 1 V15 output pin 2 Logic input pin Logic input pin Logic input pin PERST# delay time setting pin OCP delay time setting pin over current protect signal output pin V15 soft start pin V15 input pin 1 V15 input pin 2 Logic output pin V3AUX input pin 1 V3 input pin 1 V3 input pin 2 Enable input pin Input voltage
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
7/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Technical Note
Description of operations VCC BD4153FV/EFV has an independent power input pin for an internal circuit operation in order to activate UVLO, Input logic, and charge pump, the maximum current through which is rated to 2 mA. It is recommended to connect a bypass capacitor of 0.1 F or so to VCC pin. EN With an input of 2.3 volts or higher, this terminal turns to "High" level to activate the circuit, while it turns to "Low" level to deactivate the circuit (with the standby circuit current of 35 A), discharges each output and lowers output voltage If the input is lowered to 0.8 volts or less. V3_IN, V15_IN, and V3AUX_IN These are the input terminals for each channel of a 3ch switch. V3_IN and V15_IN terminals have two pins each, which should be short-circuited on the pc board with a thick conductor. And V3AUX IN terminal should be short-circuited to VCC terminal. Through these three terminals, a big current runs (V3_IN: 1.35A, V3AUX_IN: 0.275 A, and V15_IN: 0.625 A). In order to lower the output impedance of the power supply to be connected, it is recommended to provide ceramic capacitors (of B-characteristics or better) between these terminals and ground; 1 F or so between V3_IN and GND and between V15_IN and GND, and 0.1 F or so between V3AUX_IN and GND. V3, V15, and V3AUX These are the output terminals for each switch. V3 and V15 terminals have two pins each, which should be short-circuited on the pc board and connected to an ExpressCard connector with a thick conductor as shortest as possible. In order to stabilize the output, it is recommended to provide ceramic capacitors (of B-characteristics or better) between these terminals and ground; 10 F or so between V3 and GND and between V15 and GND, and 1 F or so between V3AUX and GND. CPPE# The pin used to find whether a PCI-Express signal compatible card is provided or not. Turns to "High" level with an input of 2.3 volts or higher, which means that no card is provided, while it turns to "Low" level when the input is lowered to 0.8 volts or less, which means that a card is provided. Controls turning ON/OFF of the switch according to the status of the system. CPUSB# The pin used to find whether a USB2.0 signal compatible card is provided or not. Turns to "High" level with an input of 2.3 volts or higher, which means that no card is provided, while it turns to "Low" level when the input is lowered to 0.8 volts or less, which means that a card is provided. Controls turning ON/OFF of the switch according to the system status. SYSR The pin used to detect the system status. Turns to "High" level with an input of 2.3 volts or higher, which means that the system is activated, while it turns to "Low" level when the input is lowered to 0.8 volts or less, which means that the system is on standby. PERST_IN# The pin used to control a reset signal to a card (PERST#) from the system side. (Also referred to as "SysReset#" by PCMCIA.) Turns to "High" level with an input of 2.3 volts or higher, and turns PERST# to "High" level AND with a "Power Good" output. Turns to "Low" level and turns PERST# to "Low" level when the input is lowered to 0.8 volts or less. PERST# The pin used to provide a reset signal to a PCI-Express compatible card. The status is determined by each output, PERST#_IN, CPPE# system status, and EN on/off status. Turns to "High" level and activates the PCI-Express compatible card only if each output is within the "Power Good" threshold with the card kept inserted and with PERST_IN# turned to "High" level. PERST#_DELAY Delay during which the level at PERST# pin turns from Low to High may be set with a capacitor externally applied. The delay time is determined by the regulated current (2 A), the reference voltage (0.7 volts) inside the IC and the capacitance of the capacitor externally applied. The delay time is specified as "at least 1 ms" in "ExpressCard Standard". It does not synchronize with PERST_IN#, and it synchronizes only with a "Power Good" output inside the IC. Turns to "Low" level when SW is turned OFF. OC Turns its output to "Low" level if an overcurrent condition is detected. This open drain output may be pulled up to 3.6 volts power supply via resistor. OC-Delay Delay during which the level at OC pin turns from High to Low may be set with a capacitor externally applied. The delay time is determined by the regulated current (2 A), the reference voltage (0.7 volts) inside the IC and the capacitance of the capacitor externally applied. May be used to control with the OC status fed back to the system. If fed back to EN terminal of this IC, it may be used to turn OFF the output that is provided when an overcurrent condition is detected.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
8/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Timing Chart System Status Primary OFF ON Auxiliary OFF ON Power ON/OFF Status of ExpressCardTM ExpressCARDTM Module Status Don't Care De-asserted Asserted De-asserted ON ON Asserted Before This System Status Asserted After This System Status
Technical Note
Power Switch Status Primary OFF OFF ON OFF OFF OFF Auxiliary(3.3V Aux) OFF OFF ON OFF ON OFF
ExpressCardTM States Transition Diagram SYSR=L CP#= SYSR=H CP#=HL SYSR= CP#=L V3AUX=ON V15=V3=ON SYSR=H CP#= SYSR=HL CP#=L SYSR=L CP#=L
SYSR=HL CP#=H
SYSR=L CP#=HL V3AUX=OFF V15=V3=OFF
SYSR=HL CP#=L V3AUX=ON V15=V3=OFF SYSR=LH CP#=L
SYSR=H CP#=H
System Status Stand-by Status ON Status From ON to Stand-by Status From Stand-by to ON Status :SYSR=L :SYSR=H :SYSR=HL :SYSR=LH
Card Status CardAsserted Status Card De-asserted Status From De-asserted to Asserted Status From Asserted to De-asserted Status :CP#=L :CP#=H :CP#=HL :CP#=LH
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
9/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
BD4153FV Evaluation Board Circuit
Technical Note
U1 TP16 TP15 C2 TP1 C3 TP21 VCC R7 C5
V3_AUXIN
1 2 TP17 3 4 TP2 5 C6a 6 C6 7 TP3 8 9 10 11 12
BD4153FV GND SS_V3 V3_1 V3_2 V3AUX SS_V3AUX PERST_IN# V15_1 V15_2 SYSR CPPE# CPUSB# VCAC EN V3_IN2 V3 IN1 V3_AUXIN PERST# V15 IN2 V15 IN1 SS_V15 OC OC DELAY
PERST#_DELAY
24 23 TP13 22 21 TP22 20 19 TP10 18 17 16 15 14 13 C14 C13 C16 C24
R24 R23 S1
VCC TP14 C23 TP20 C21 TP12 TP11 C20 TP19 C17
C23a
R20
S2 TP4
R7a
C7
TP18 C8 R10a
TP6 S4 S5 S6 VCC R10 R11 R12 TP7 TP8
TP9
R11a R12a
VCC R18 R15
C10 C11 C12
BD4153FV Evaluation Board Application Components
Part No U1 R7 R10 R10a R11 R11a R12 R12a R15 R18 R20 R23 R24 C2 C3 C5 C6
Value 10k 10k 0 120k 0 120k 0 10k 0 0 10 2200pF 10F 1F 0.01F
Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM
Parts Name BD4153FV MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCR03series MCH185CN222K NCH218CN106K MCH213CN105K MCH185CN103K
Part No C6a C7 C8 C10 C11 C12 C13 C14 C16 C17 C20 C21 C23 C23a C24
Value 10F 0.033F 0.22F 2200pF 1F 0.1F 1F 0.1F 0.1F
Company ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM
Parts Name NCH218CN106K MCH182CN333K MCH212CN224K MCH185CN222K MCH213CN105K MCH182CN104K MCH213CN105K MCH182CN104K MCH182CN104K
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
10/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
BD4153FV Evaluation Board Layout Silk Screen TOP Layer
Technical Note
Mid Layer 1
Mid Layer 2
Bottom Layer
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
11/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Apprication Circuit (Circuit for ExpressCardTM Compliance Checklist) BD4153FV CPPE#(1) CPUSB#(2) 3.3V(3) 3.3Vaux(4) 1.5V(5) PERST#(6) VCC OC(15pin) OC_Delay(14pin) SYSR(10pin) SS_V3(2pin) SS_V3AUX(6pin) PERST#_Delay(13pin) SS_V15(16pin) GND(1pin) CPPE#(11pin) CPUSB#(12pin) V3(3,4pin) V3AUX(5pin) V15(8,9pin) PERST#(19pin) VCC(24pin) V3_IN(21,22pin) V3AUX_IN(20pin) V15_IN(17,18pin) PERST_IN#(7pin) EN(23pin) 3.3V(7)
Technical Note
3.3Vaux(8) 1.5V(9) SysReset#(10)
About heat loss In designing heat, operate the apparatus within the following conditions. (Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.) 1. Ambient temperature Ta shall be not more than 125C. 2. Chip junction temperature Tj shall be not more than 150C. Chip junction temperature Tj can be considered under the following two cases. Chip junction temperature Tj is found from IC surface temperature TC under actual application conditions:Tj=TC+j-cxW Reference value j-c:SSOP-B24 33/W HTSSOP-B24 36/W Chip junction temperature Tj is found from ambient temperature Ta:Tj=TC+j-axW Reference value j-a:SSOP-B24 243.9/W (IC only) 147.1/W Single-layer substrate (substrate surface copper foil area: less 3%) j-a:HTSSOP-B24 113.6/W Single-layer substrate (substrate surface copper foil area: less 3%) 73.5/W Double-layer substrate 2 (substrate surface copper foil area:15x15mm ) 44.6/W Double-layer substrate 2 (substrate surface copper foil area: 70x70mm ) 31.3/W Fourth-layer substrate 2 (substrate surface copper foil area: 70x70mm ) Most of heat loss in BD4153FV occurs at the output switch. The power lost is determined by multiplying the on-resistance by the square of output current of each switch. As BD4153EFV employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
12/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Equivalent Circuit 2pin 3,4pin
V3_IN V3_IN V3AUX_IN
Technical Note
VD
5pin
SS_V3
6pin
VCC V3AUX
V3AUX_IN SS_V3AUX
7pin
VCC VCC VCC
8,9pin
V15_IN V15_IN
10pin
SS_V15 VCC VCC
11pin
VCC VCC
12pin
VCC VCC
13pin
VCC VCC
14pin
VCC VCC
15pin
16pin
17,18pin
VCC
19pin
VCC VCC
20pin
V15
V3AUX
21,22pin
23pin
24pin
V3
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
13/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Technical Note
Note For Use 1.Absolute maximum ratings For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 2.GND potential Bring the GND terminal potential to the minimum potential in any operating condition. 3.Thermal design Consider allowable loss (Pd) under actual working condition and carry out thermal design with sufficient margin provided. 4.Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. 5.Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. 6.Built-in thermal shutdown protection circuit The present IC incorporates a thermal shutdown protection circuit (TSD circuit). The working temperature is 175C (standard value) and has a -15C (standard value) hysteresis width. When the IC chip temperature rises and the TSD circuit operates, the output terminal is brought to the OFF state. The built-in thermal shutdown protection circuit (TSD circuit) is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. 7.Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1000 F between output and GND. 8.Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. 9.IC terminal input + The present IC is a monolithic IC and has a P substrate and P isolation between elements. With this P layer and N layer of each element, PN junction is formed, and when the potential relation is GND>terminal A>terminal B, PN junction works as a diode, and terminal B>GND terminal A, PN junction operates as a parasitic transistor. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal.
Resistor PIN A PIN B C NPN Transistor Structure (NPN) B E Parasitic diode GND N P+ N N P substrate N Parasitic diode GND Parasitic diode N P substrate GND Nearby other device Parasitic diode P P+ P+ N N C B E GND P P+ PIN A
GND PIN B
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
14/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Technical Note
10. GND wiring pattern If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of component externally connected, pay special attention not to cause undesirable change to it. 11. Electrical characteristics The electrical characteristics in the Specifications may vary depending on ambient temperature, power supply voltage, circuit(s) externally applied, and/or other conditions. It is therefore requested to carefully check them including transient characteristics. 12. Capacitors to be applied to the input terminals The capacitors to be applied to the input terminals (VCC, V3_IN, V3AUX_IN and V15_IN) are used to lower the output impedance of the power supply to be connected. An increase in the output impedance of the power supply may result in destabilization of input voltages (VCC, V3_IN, V3AUX_IN and V15_IN). It is recommended to use a low ESR capacitor with less temperature coefficient (change in capacitance vs. change in temperature), 0.1 F more or less for VCC and V3AUX_IN while 1 F more or less for V3_IN and V15_IN, but it must be thoroughly checked at the temperature and with the load of the range expected to use because it significantly depends on the characteristics of the input power supply to be used and the conductor pattern of the pc board. 13. Capacitors to be applied to the output terminals To the output terminals (V3, V3_AUX, and V15), the output capacitors should be connected between the respective output terminal and GND. It is recommended to use a low ESR capacitor with less temperature coefficient, 1 F more or less for V3 and V15 terminals while 1F more or less for V3_AUX, but it must be thoroughly checked at the temperature and with the load of the range expected to use because it significantly depends on the temperature and the load conditions. 14. Not of a radiation-resistant design. 15. .Allowable loss Pd With respect to the allowable loss, the thermal derating characteristics are shown in the Exhibit, which we hope would be used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the allowable loss, reduction of current capacity due to chip temperature rise, and other degraded properties inherent to the IC would result. You are strongly urged to use the IC within the allowable loss. 16. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. OUTPUT PIN
17. Operating ranges If it is within the operating ranges, certain circuit functions and operations are warranted in the working ambient temperature range. With respect to characteristic values, it is unable to warrant standard values of electric characteristics but there are no sudden variations in characteristic values within these ranges. 18. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm the characteristics before using the IC.In addition, when the IC is used with the external circuit changed, decide the IC with sufficient margin providedwhile consideration is being given not only to static characteristics but also variations of external parts and our IC including transient 19. Wiring to the input terminals (V3 IN, V3AUX IN, and V15 IN) and output terminals (V3, V3AUX and V15) of built-in FET should be carried out with special care. Unnecessarily long and/or thin conductors used in wiring may result in degradation of characteristics including decrease in output voltage. 20. Heatsink Heatsink is connected to SUB, which should be short-circuited to GND. Solder the heatsink to a pc board properly, which offers lower thermal resistance.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
15/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Power Dissipation BD4153FV [W] 1.4 1.2
1.025W Mounted on board 70mmx70mmx1.6mm Glass-epoxy PCB j-a=122.0/W
Technical Note
BD4153EFV [W] 5
4.0W measureTH-156Kuwano-Denki measure conditionRohm Standard Board PCB size70mmx70mmx1.6mmt (PCB with Thermal Via)
PCBSingle-layer substrate substrate surface copper foil area:0mmx0mm PCBDouble-layer substrate substrate surface copper foil area:15mmx15mm PCBDouble-layer substrate substrate surface copper foil area:70mmx70mm PCBFourth-layer substrate substrate surface copper foil area:70mmx70mm
4
1.0 Power Dissipation (Pd)
Without heat sink.
0.8 0.6 0.4 0.2 0 0
0.787W
Power Dissipation (Pd)
j-a=158.7/W
3
2.8W
2
1.7W 1.1W
100
PCBja=113.6/W PCBja=43.5/W PCBja=44.6/W PCBja=31.3/W
1
25
50
75
100
125
Ambient Temperature (Ta)
150 []
0
25
50
75
100
125
Ambient Temperature (Ta)
150 []
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.05 - Rev.A
BD4153FV,BD4153EFV
Ordering part number
Technical Note
B
D
4
1
5
3
F
V
-
E
2
Part Number
Part Number
Package FV : SSOP-B24 EFV : HTSSOP-B24
Packaging and forming specification E2: Embossed tape and reel (SSOP-B24/ HTSSOP-B24)
SSOP-B24
7.8 0.2 (MAX 8.15 include BURR)
24 13

Tape Quantity Direction of feed
0.3Min.
Embossed carrier tape 2000pcs E2
The direction is the 1pin of product is at the upper left when you hold
7.6 0.3
5.6 0.2
( reel on the left hand and you pull out the tape on the right hand
)
1
12
1.15 0.1
0.15 0.1
0.1
0.65 0.22 0.1
0.1
1pin
(Unit : mm)
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
HTSSOP-B24
7.80.1 (MAX 8.15 include BURR) (5.0)
24 13

+6 4 -4
0.530.15
Tape Quantity
1.00.2
Embossed carrier tape (with dry pack) 2000pcs E2
The direction is the 1pin of product is at the upper left when you hold
7.60.2
5.60.1
Direction of feed
(3.4)
( reel on the left hand and you pull out the tape on the right hand
)
1
12
0.325
0.850.05
1PIN MARK S
+0.05 0.17 -0.03
1.0MAX
0.080.05
0.65 +0.05 0.24 -0.04
0.08 S 0.08
M
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
17/17
2009.05 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
R0039A

▲Up To Search▲

Price & Availability of BD4153FV09

	To Download BD4153FV09 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .